Low MOQ for Surface Mount Diode - Highly Stable and Reliable Surface Mount PAR® Transient Voltage Suppressors (TVS) DO-218AB SM5S – Yunyi

Strong Points of DO-218AB SM5S:

1. The chip inside is processed by globally leading technology of Chemical Etching Method, free from the negative effects caused by cutting stress.

2. DO-218AB has strong reverse surge capability, thanks to the chip’s larger size than its competitors’.

3. Low leakage current from the edge of chip

4. TJ = 175 °C capability suitable for high reliability and automotive requirement

5. Low forward voltage drop

6. Meets ISO7637-2 surge specification (varied by test condition)

7. Meets MSL level 1, per J-STD-020, LF maximum peak of 245 °C

Steps of Chip Production

1. Mechanically Printing（Super-precise automatic wafer printing）

2. Automatic First-etching （Automatic Etching Equipment，CPK>1.67）

3. Automatic Polarity Test（Precise Polarity Test）

4. Automatic Assembly （Self-developed Automatic Precise Assembly）

5. Soldering (Protection with Mixture of Nitrogen & Hydrogen

Vacuum Soldering )

6. Automatic Second-etching (Automatic Second-etching with Ultra-pure Water)

7. Automatic Gluing (Uniform Gluing & Precise Calculation are Realized by Automatic Precise Gluing Equipment)

8. Automatic Thermal Test (Automatic Selection by Thermal Tester)

9. Automatic Test(Multifunctional Tester)